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iPhone 6 Teardown Reveals What's Inside Apple's New Smartphones

Posted by Unknown Jumat, 19 September 2014 0 comments
International Business TimesiPhone 6 Teardown Reveals What's Inside Apple's New SmartphonesInternational Business TimesThe smartphone's logic board components also include the M8 motion co-processor, 16GB flash storage by South Korean manufacturer SK Hynix and a near-field communication, or NFC, chip by Dutch manufacturer NXP, which is used to power Apple Pay.
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